BGA inspection using the Dage XiDAT XD7600 allows us to offer the electronics industry fast turnaround, high resolution digital X-ray images, and a simple report including images of defects, which we return with the assemblies.
Simple low resolution X-ray images of BGAs may miss many of the defects we pick up with the Dage XD7600. Our inspection will include low and high resolution viewing, plus angled viewing to help highlight bridges, shorts, odd shaped joints and voiding including champagne voiding.
If you are to rely upon an X-ray service for BGA inspection then choose one that has the best tools available. Our service has been running for over two years and we have inspected many hundreds of thousands of BGA joints.
If you are looking for a fast turnaround professional BGA X-ray inspection service they please talk to us today.
Soldertec Members receive preferential access to our laboratory services at a discounted rate.
For more details of the Dage XiDAT XD7600 that we use please visit http://www.dageinc.com
Call us today to discuss your individual problems.
Contact:
Zoe Sullivan on +44-1727-871 307 or zoe.sullivan@itri.co.uk
Switchboard +44-1727-875 544
Dage article on Xray inspection of Flipchips and BGAs (images included)
Dage selection criteria for Xray inspection
Picture of Dage XiDAT XD7600 in action
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