Electronics industry assocations are announcing their 2010 conference schedules, including technical programmes featuring the latest developments in soldering technology.

SMTA will hold its 2010 International Conference on Soldering and Reliability this May in Toronto, Ontario, Canada. SMTA has also linked to Auburn University to announce the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium in October, Orlando, Florida, US.

SMTA South East Asia will also hold a large Technical Conference on Electronics Assembly Technologies in November in Penang, Malaysia.

The Centre for Advanced Life Cycle Engineering (CALCE) at University of Maryland, US will hold the 4th International Symposium on Tin Whiskers in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University, Japan.

IPC Expo Conference and Exhibition will take place in Las Vegas, US on April 6-9th 2010. This event will discuss several important new lead-free soldering topics including head-in-pillow defects, BGA mixed soldering,  reliability acceleration factors and low silver technologies.